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電解鍍金에 의해 형성된 半導體 高速鍍金용 주석-납 合金皮膜의 特性硏究 원문보기

  • 저자

    정강효

  • 학위수여기관

    昌原大學校

  • 학위구분

    국내석사

  • 학과

    環境·化工시스템工學科

  • 지도교수

  • 발행년도

    2002

  • 총페이지

    v, 51장.

  • 키워드

  • 언어

    kor

  • 원문 URL

    http://www.riss.kr/link?id=T8935971&outLink=K  

  • 초록

    Tin-lead alloys have rapidly deposited in high speed plating machines with jet agitation. High speed plating is achieved through the use of high current density. In this study, we dealt with high speed electroplating, effects of additives and electrolyte conditions were investigated on electroplating from methane sulfonate bath. The Sn content on electrodeposit was highly decreased with increasing current density from 10A/d㎡ to 50A/d㎡, and besides the current efficiency on the cathode was decreased. The carbon conent on electrodeposit was decreased with increasing current density from 10A/d㎡ to 30A/d㎡, however in the range of 40A/d㎡ ~50A/d㎡, the carbon content was highly increased. The formation of tetravalent tin and stannic oxide sludge was prevented by addition of gallic acid in the bath and the changing of Sn content on electrodeposit is caused by addition of gallic acid from 0g/L to 2.5g/L.


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