최적 정합 알고리즘을 사용한 반도체 소자의 실시간 마킹/표면 검사 시스템 개발
(A) Development of Real-Time Vision System Using Optimal Matching Algorithm for Marking/Surface Inspection of Semiconductor Device
전자공학과 영상처리 전공
최적정합 알고리즘 반도체 마킹표면 검사시스템;
- 원문 URL
In this paper, proposed high speed making/surface inspection method, that use adaptive automatic acquisition algorithm and real time matching algorithm of model data. Developed automatic acquisition algorithm of adaptive model data extracts the region to fit in semiconductor characteristics, and can be create models of several semiconductor regardless of position and type, real time matching algorithm proposed geometrical pattern matching method to minimize effect of external environment of making/surface and only use semiconductor characteristic information. Semiconductor inspection system that apply method to propose is may shorten processing time at a manufacturing process of semiconductor, productivity upgrade of semiconductor, localization of inspection equipment, reduce of the rate of dependence on imports and international competitiveness.