본문 바로가기
HOME> 논문 > 논문 검색상세

학위논문 상세정보

광섬유 센서를 이용한 WIM Mold Package 에 관한 연구 원문보기
Study about WIM mold package using Optical fiber sensors

  • 저자

    조성규

  • 학위수여기관

    호서대학교 벤처전문대학원

  • 학위구분

    국내석사

  • 학과

    첨단산업기술전공

  • 지도교수

  • 발행년도

    2002

  • 총페이지

    1책(면수복잡)

  • 키워드

    광섬유 센서 WIM Mold Package;

  • 언어

    kor

  • 원문 URL

    http://www.riss.kr/link?id=T10050916&outLink=K  

  • 초록

    In our research, we focused in optimization of WIM Mold which is used in high speed scale system using fiber optic sensor. The problem of Mold is the non-linearity in the relation of weight and variability at the Mold pad. It can be compensated by remolding the structure and thermal process. Also, for the easiness of movement and installation, the structure remolding is done to I shape. It makes the whole Mold incline 0.154 approximately. This value is small enough so that we can regard it the optimized Mold. This research is experimented indoor and outdoor as well. We conclude that our enhanced WIM Mold is adequate to be used in high speed scale system. But because of the measuring error while we are scaling the weight in the WIM system, it is a little bit difficult to be installed in the field right away. In our future research, we are going to stabilize the system and we will be able to apply it to the new system which are a combination of existing scale system and speed measuring system.


 활용도 분석

  • 상세보기

    amChart 영역
  • 원문보기

    amChart 영역