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아크 이온플레이팅으로 증팍한 TIN코팅의 잔류응력 원문보기
Residual stress in TIN films deposited by arc ion plating

  • 저자

    연제영

  • 학위수여기관

    한서대학교 대학원

  • 학위구분

    국내석사

  • 학과

    신소재공학과

  • 지도교수

  • 발행년도

    2005

  • 총페이지

    vii, 55p.

  • 키워드

    아크이온플레이팅 Tin코팅 잔류응력;

  • 언어

    kor

  • 원문 URL

    http://www.riss.kr/link?id=T10065164&outLink=K  

  • 초록

    TiN thin films were deposited on tool steels and WC-Co substrates by arc ion plating. The effects of temperature and bias voltage on microstructure, residual stress, hardness, and critical load of the TiN thin films were investigated. Microstructure of TiN thin films changed from zoneⅠ to zone T type as the bias voltage increased. Hardness increased with residual stress. As bias voltage increased from 30V to 100V, the residual stress and the critical load of the TiN thin films tended to increased. But higher bias voltage than 100V reduced the residual stress and critical load, which resulted from increased defects in the film due to higher Ti ion energy. Lower residual stress was obtained at higher deposition temperature. It means that growth residual stress is almost same in range of the deposition temperatures investigated. A thesis submitted to Committee of the Graduate School of Hansro University in partial fulfillment of the requirements for the degree of Master Theology in August, 2005


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