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Sn-3.5Ag-xBi/Cu 솔더 접합부 시효 시 금속간 화합물의 성장 거동 원문보기
Growth Kinetics of Intermetallic Compounds during Aging Sn-3.5Ag-xBi/Cu Solder Joints

  • 저자

    김순태

  • 학위수여기관

    고려대학교 대학원

  • 학위구분

    국내석사

  • 학과

    신소재공학과

  • 지도교수

  • 발행년도

    2004

  • 총페이지

    ⅵ, 66p.

  • 키워드

    Electronic packaging 솔더링공정 금속화합물;

  • 언어

    kor

  • 원문 URL

    http://www.riss.kr/link?id=T10070401&outLink=K  

  • 초록

    The effect of Bi addition to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130℃, 150℃ and 180℃. At 150℃ and 180℃, the growth rate of the Cu_(6)Sn_(5) (η) layer was significantly enhanced, but that of the Cu_(3)Sn (ε) layer was rather reduced with increasing Bi addition up to 12 wt.%. However, at 130℃, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu_(6)Sn_(5) layers can affect not only the interfacial reaction barrier but also the local thermodynamics, such as local phase compositions at the η/solder interface, and the diffusivities in the solder region.


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