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무전해 Ni-P-W 도금에서의 착화제의 영향 원문보기

  • 저자

    최치서

  • 학위수여기관

    경상대학교 융합과학기술대학원

  • 학위구분

    국내석사

  • 학과

    생산기술공학과 나노신소재공학

  • 지도교수

  • 발행년도

    2014

  • 총페이지

    ⅷ, 49 p.

  • 키워드

    무전해 Ni-P-W 도금;

  • 언어

    kor

  • 원문 URL

    http://www.riss.kr/link?id=T13534276&outLink=K  

  • 초록

    In this study, the affects of complexing agent(ㆍ2) on Ni-P-W electroless plating were investigated. Ni-P-W electroless plating was conducted in the solutions having 5 different complexing agent concentrations from 0.1 mol/L to 0.5 mol/L respectively. All the chemicals used in this experiment are reagent grade. The temperature was controlled at 90℃ within the error range of ± 2 ℃. As the source of metal, nickel sulfate and sodium tungsten were used. Ni-P-W alloy plating was performed using a 100 ml beaker in the laboratory. To remove the contaminants of specimens, the specimens was immersed for 10 minutes in the 0.2 g/L alkaline solution. And then 10% HCl solution was used to remove an oxide film formed on the surface of specimen. As concentration of complexing agent increases, the content of tungsten decreases due to decrease of deposition rate and thickness while stable ionic bands are maintained. Surface roughness is increased with the increase of concentration of complexing agent. The hardness of Ni-P-W electroless plated samples were measured by rockwell hardness tester and the results indicate that the average hardness value was about 950 Hv. From the results of varying complexing agent content, it could be mentioned that electroless Ni-P-W plating with optimum amount of complexing agent could replace conventional 6+ chrome electroplating.


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