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Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 $\mu$BGA Solder접합부의 열피로 수명예측
Prediction of Thermal Fatigue Life on $\mu$BGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys

김연성   (중앙대학교 기계공학부UU0001197  ); 김형일   (중앙대학교 기계공학부UU0001197  ); 김종민   (오사카대학교 공학연구소 생산과학  ); 신영의   (중앙대학교 기계공학부UU0001197  );
  • 초록

    This paper describes the numerical prediction of the thermal fatigue life of a $\mu$ BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$ , which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.


  • 주제어

    Sn-Ag base solder .   Thermal fatigue life .   Finite element method .   Solder joint .   Micro ball grid array.  

  • 참고문헌 (16)

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    1. 2004 "Darveaux 모델에 의한 플립칩 패키지 솔더 접합부의 열피로 해석 및 수명 평가" 大韓溶接學會誌 = Journal of the Korean Welding Society 22 (6): 36~42    
  • 김형일 (1)

  • 신영의 (49)

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