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KSME international journal v.18 no.3, 2004년, pp.357 - 369   피인용횟수: 2

Fracture Analysis of Electronic IC Package in Reflow Soldering Process

Yang, Ji-Hyuck   (Currently, Hyundai Motor CompanyCC0003089  ); Lee, Kang-Yong   (School of Mechanical Engineering, Yonsei UniversityUU0000936  ); Lee, Taek sung   (Department of Mechanical Design Engineering, Korea Polytechnic UniversityUU0001397  ); Zhao, She-Xu   (Department of Engineering Mechanics, Shanghai Jiaotong University  );
  • 초록

    The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.


  • 주제어

    Plastic IC Package .   Polyimide Coating .   Viscoelastic Analysis .   C(t)-integral Value .   Hygrothermal Loading.  

  • 참고문헌 (23)

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  • 이 논문을 인용한 문헌 (2)

    1. 2004. "" KSME international journal, 18(9): 1572~1581     
    2. 2006. "" Journal of mechanical science and technology, 20(2): 185~190     

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