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LCD Module내 COF Bending에 따른 Lead Broken Failure의 개선
Improvement of COF Bending-induced Lead Broken Failure in LCD Module

심범주   (삼성전자(주) LCD 총괄CC0101996  ); 최열   (삼성전자(주) LCD 총괄CC0101996  ); 이준신   (성균관대학교 정보통신공학부UU0000759  );
  • 초록

    TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.


  • 주제어

    OLB .   PCB .   Bonding .   COF .   Lead broken.  

  • 참고문헌 (11)

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    5. C. S. Jang, "Issue in assembly process of next-generation fine-pitch chip-on-flex packages for LCD applications", IEEE Transaction on advanced packaging, Vol. 30, No. 1, p. 2, 2007 
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