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大韓齒科保存學會誌 = Journal of Korean Academy of Operative Dentistry v.35 no.2, 2010년, pp.125 - 133   피인용횟수: 1
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복합레진의 exponential 중합법이 상아질접착제의 미세인장접착강도에 미치는 영향
EFFECT OF THE EXPONENTIAL CURING OF COMPOSITE RESIN ON THE MICROTENSILE DENTIN BOND STRENGTH OF ADHESIVES

성소래   (서울대학교 치의학대학원 치과보존학교실  ); 서덕규   (서울대학교 치의학대학원 치과보존학교실  ); 이인복   (서울대학교 치의학대학원 치과보존학교실  ); 손호현   (서울대학교 치의학대학원 치과보존학교실  ); 조병훈   (서울대학교 치의학대학원 치과보존학교실  );
  • 초록

    접착제를 통해 치아에 접착되는 상부의 복합레진의 빠른 중합은 접착제층에 높은 중합수축응력을 발생시킨다. 중합수축응력을 경감시키기 위해서, LED 광중합기의 하나인 Elipar FreeLight 2 (3M ESPE, USA)에서는 최초 5초 이내에 광강도를 증가시키는 exponential 중합법을 채택하고 있다. 본 연구에서는 짧은 시간내에 광강도를 증가시키는 exponential 중합법이 복합레진의 초기 중합수축속도를 효과적으로 조절할 수 있는지를 알아보기 위해 접착제 적용 후 상부의 복합레진을 exponential 중합법과 continuous 중합법으로 중합하여 상아질접착제의 미세인장접착강도를 비교하였다. 3M사의 Scotchbond Multipurpose Plus (MP), Single Bond 2 (SB), 및 Adper Prompt (AP)의 세 종류의 접착제를 발치한 대구치의 교합면 상아질에 제조사의 지시에 따라 적용하고, 혼합형 복합레진인 Denfil (Vericom, Korea)을 두 가지광중합방법으로 중합하였다. 접착 후 48시간에 미세인장접착강도를 측정하고, 파절면은 FE-SEM.으로 관찰하였다. 그 결과, 각각의 접착제에서 중합방법에 따른 접착강도의 차이는 관찰할 수 없었다(Two-way ANOVA, p > 0.05). MP와 SB의 미세인장접착강도는 AP에 비해 유의하게 높았다(p


    Objectives: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. Methods: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. Results: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p


  • 주제어

    중합수축 .   Exponential 중합법 .   상아질접착제 .   미세인장접착강도 .   파절양상.  

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  • 이 논문을 인용한 문헌 (1)

    1. Park, Eun-Sook ; Kim, Chang-Keun ; Bae, Ji-Hyun ; Cho, Byeong-Hoon 2011. "The effect of the strength and wetting characteristics of Bis-GMA/TEGDMA-based adhesives on the bond strength to dentin" 大韓齒科保存學會誌 = Journal of Korean Academy of Operative Dentistry, 36(2): 139~148     

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