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한국재료학회지 = Korean journal of materials research v.22 no.4, 2012년, pp.169 - 173   SCOPUS 피인용횟수: 1
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Al 합금과 STD61강의 소착에 미치는 첨가원소 Fe, Mn의 영향
Effects of Fe, Mn Contents on the Al Alloys and STD61 Steel Die Soldering

김유미    (전남대학교   ); 홍성길    (전남대학교   ); 최세원    (한국생산기술연구원   ); 김영찬    (한국생산기술연구원   ); 강창석    (한국생산기술연구원  );
  • 초록

    Recently, various attempts to produce a heat sink made of Al 6xxx alloys have been carried out using die-casting. In order to apply die-casting, the Al alloys should be verified for die-soldering ability with die steel. It is generally well known that both Fe and Mn contents have effects on decreasing die soldering, especially with aluminum alloys containing substantial amounts of Si. However, die soldering has not been widely studied for the low Si aluminum (1.0~2.0wt%) alloys. Therefore, in this study, an investigation was performed to consider how the soldering phenomena were affected by Fe and Mn contents in low Si aluminum alloys. Each aluminum alloy was melted and held at $680^{\circ}C$ . Then, STD61 substrate was dipped for 2 hr in the melt. The specimens, which were air cooled, were observed using a scanning electron microscope and were line analyzed by an electron probe micro analyzer. The SEM results of the dipping soldering test showed an Al-Fe inter-metallic layer in the microstructure. With increasing Fe content up to 0.35%, the Al-Fe inter-metallic layer became thicker. In Al-1.0%Si alloy, the additional content of Mn also increased the thickness of the inter-metallic layer compared to that in the alloy without Mn. In addition, EPMA analysis showed that Al-Fe inter-metallic compounds such as $Al_2Fe$ , $Al_3Fe$ , and $Al_5Fe_2$ formed in the die soldering layers.


  • 주제어

    die soldering .   Al-Si .   Fe .   Mn .   metallic compound.  

  • 참고문헌 (19)

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  • 이 논문을 인용한 문헌 (1)

    1. Jeong, Eun-Wook ; Kim, Hoi-Bong ; Kim, Dong-Yong ; Kim, Min-Jung ; Cho, Young-Rae 2012. "Effects of Annealing Temperature on Interface Properties for Al/Mild Steel Clad Materials" 한국재료학회지 = Korean journal of materials research, 22(11): 591~597     

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