Multilayer materials for 2000
During the next seven years, PWB multilayer materials will be driven by packaging densities. Although the exact configuration of the new designs is difficult to predict, one trend is obvious. As these technologies mature, advanced multilayer materials will play a key role in obtaining higher manufacturing yields and achieving the physical and electrical properties necessary for this next level of interconnection. Concurrent engineering, which is design simultaneous with material and process development, will be the first step in bringing these new interconnects to market quickly and effectively. One step further in this process is the development of factories that facilitate concurrent engineering, thereby promoting a reduced time to market for new materials. Multilayers continue to trend toward finer lines and spaces, and each incremental movement in the reduction of lines and spaces requires multilayer laminates and prepregs with improved cleanliness, uniformity, and surface conditions. Two new density requirements that will also have a significant influence on the types of multilayer materials needed through the year 2000 are annular ring size reduction and lean design.
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