Micromechanical behavior of single crystalline Ni3Sn4 in micro joints for chip-stacking applications
Abstract The micromechanical behavior of single crystalline Ni 3 Sn 4 with different crystallographic orientations are investigated by using micropillar compression and nanoindentation. Knowledge of the mechanical behavior of Ni 3 Sn 4 is important because of its application in micro joints for chip-stacking applications. During high temperature aging, annealing twins easily form in Ni 3 Sn 4 and the twin elements are identified. The stress-strain curves from micropillar compression show that Ni 3 Sn 4 usually exhibits a brittle fracture behavior. However, pillars with certain orientations do not undergo catastrophic fracture, but are able to deform plastically. Transmission electron microscopy analysis shows that dislocations with Burgers vector [0 1 0] are involved in the plastic deformation and the slip system of Ni 3 Sn 4 is (1 0 0)[0 1 0]. The reasons why Ni 3 Sn 4 slips on (1 0 0) plane along [0 1 0] direction is discussed in terms of its crystal structure and Peierls-Nabarro model. In addition, grain orientations near (19 7 1) and ( 17 ̅ 6 1) are more likely to activate the slip system (1 0 0)[0 1 0], and exhibit better mechanical properties. Young's modulus, yield strength, fracture strength, strain at fracture, and strain at yield along several orientations are reported.
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