본문 바로가기
HOME> 논문 > 논문 검색상세

논문 상세정보

Microelectronics journal v.60, 2017년, pp.87 - 93   SCIE
본 등재정보는 저널의 등재정보를 참고하여 보여주는 베타서비스로 정확한 논문의 등재여부는 등재기관에 확인하시기 바랍니다.

A digital technique for diagnosing interconnect degradation by using digital signal characteristics

Lee, J. Kwon, D.
  • 초록  

    Interconnects are responsible for mechanical and electrical connection of electronic components, and they are essential in the operation of electronic components. Suess-induced substances can degrade interconnect properties and functions because they exert stress conditions such as chemical stress to interconnects. Chemical stress from moisture or contaminants causes corrosion to interconnects, and as a result interconnect failures occur in which the interconnects cannot conduct the intended functions. Since interconnect failure disturbs the connection between electronic components, it can cause ensuing failures such as electronic failures. Many approaches have been developed to detect interconnect degradation and prevent ensuing failures. In industrial fields, approaches to detect interconnect failure based on DC resistance have been widely used since DC resistance can capture electrical discontinuity. However, approaches based on DC resistance have a problem because they usually require additional sensing devices or circuitries. This study introduces a new approach to interconnect failure detection using digital signals. The proposed method using digital signals detects interconnect failures without additional sensing devices. Interconnect failure detection can be conducted by monitoring and analyzing the signal characteristics of the transmitted signal because digital signal is continuously generated and transmitted in electronics to control the electronic components and communicate between the components, and also because digital signal is in high-speed, the characteristics of the transmitted digital signal is deteriorated by physical damages on transmitted circuitries such as corrosion on interconnects. We designed accelerated life tests (ALT) of interconnects under chemical stress in order to demonstrate failure detection capability. While solder joints were exposed to chemical stress and corroded gradually, the digital signal characteristics were monitored with DC resistance simultaneously and analyzed by Sequential Probability Ratio Test (SPAT) to determine the times-to-failure of the solder joints. The test results demonstrated that the proposed approach based on digital signal can detect interconnect failures earlier than the DC resistance, which means that the proposed approach can enable electronic components to detect interconnect failures by themselves.


  • 주제어

    Reliability .   Signal integrity .   Interconnect .   Impedance .   Failure Diagnose.  

 활용도 분석

  • 상세보기

    amChart 영역
  • 원문보기

    amChart 영역

원문보기

무료다운로드
  • 원문이 없습니다.

유료 다운로드의 경우 해당 사이트의 정책에 따라 신규 회원가입, 로그인, 유료 구매 등이 필요할 수 있습니다. 해당 사이트에서 발생하는 귀하의 모든 정보활동은 NDSL의 서비스 정책과 무관합니다.

원문복사신청을 하시면, 일부 해외 인쇄학술지의 경우 외국학술지지원센터(FRIC)에서
무료 원문복사 서비스를 제공합니다.

NDSL에서는 해당 원문을 복사서비스하고 있습니다. 위의 원문복사신청 또는 장바구니 담기를 통하여 원문복사서비스 이용이 가능합니다.

이 논문과 함께 출판된 논문 + 더보기