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Ceramics international v.43 no.6, 2017년, pp.5283 - 5291   SCI SCIE SCOPUS
본 등재정보는 저널의 등재정보를 참고하여 보여주는 베타서비스로 정확한 논문의 등재여부는 등재기관에 확인하시기 바랍니다.

The effect of metal coatings on the interfacial bonding strength of ceramics to copper in sintered Cu-SiC composites

Jarząbek, Dariusz M. (Institute of Fundamental Technological Research, Polish Academy of Sciences, Warsaw, Poland ) ; Milczarek, Michał (Faculty of Mechatronics, Warsaw University of Technology, Warsaw, Poland ) ; Wojciechowski, Tomasz (Institute of Physics, Polish Academy of Sciences, Warsaw, Poland ) ; Dziekoński, Cezary (Institute of Fundamental Technological Research, Polish Academy of Sciences, Warsaw, Poland ) ; Chmielewski, Marcin (Institute of Electronic Materials Technology, Warsaw, Poland ) ;
  • 초록  

    Abstract Cu-SiC composites are very promising materials which have high thermal and electrical conductivity and may find many applications. Unfortunately, the main disadvantage of these materials is the dissolution of silicon in copper at elevated temperature, which significantly reduces their properties. In order to overcome this problem particles can be coated with a protective material before sintering. In this paper– the influence of three different metallic coatings on bonding strength were investigated. SiC particles were coated with tungsten, chromium or titanium. As reference a material with uncoated particles was prepared. The experiments were carried out with the use of microtensile tester. The highest increase in strength was observed in the case of chromium coating. On the other hand, the titanium coating, which was of very poor quality, decrease the bonding strength in comparison with uncoated particles. Furthermore, scanning electron and optical microscopes were used to determine the mechanism of debonding.


  • 주제어

    Interfacial bonding strength .   Metal matrix composites .   Tensile strength .   Silicon carbide particles.  

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